Rittal Corporation and IBM have formed a global alliance, grown from a successful cooperative effort launched in the EMEA region (Europe, Middle East and Africa) in 2015. Rittal’s expertise in IT infrastructure coupled with IBM’s resiliency services in planning, constructing, operating and servicing data centers forms the basis for construction of data center projects.
Last year, Rittal TS Enclosures and LCP high density cooling products were selected as the infrastructure solution for a single event - the DARPA Cyber Grand Challenge. The Defense Advanced Research Projects Agency, an agency of the U.S. Department of Defense responsible for the development of emerging technologies for use by the military, sponsored this first ever Cyber Grand Challenge (CGC).
Busbar Is the Easy Choice to Replace Traditional Wiring
In the age of the Internet of Things and a world that is globally connected, cybersecurity – the need to safeguard information from an unending deluge of threats – has become a key technology challenge in the 21st Century. DARPA, the Defense Advanced Research Projects Agency, has recognized the dangers posed by cyber warfare from individual hackers to government-sponsored agencies.
$3.75 Million Prize Pool for Machine Versus Machine Event
Commitment and value is delivered with the TS IT Dynaload. First, you'll appreciate the intelligent, economical packaging, fully adherent to Safe Transit Association (ISTA) guidelines. All packaging is suitable for reuse. Unpack, and it is rack ready for build out and rapid deployment to its data center application.
Great for Small, and Cool for All
Your data center can build up heat quickly from your computer hardware. This can be dangerous for your computer and your data! If the "comfort temperature" isn't maintained, shortened service life or even total system failure is a real threat.